* Late registration is possible by contacting office@skills-alliance.eu
AGENDA
Meet and Greet - Monday 20th April 2026
18:30 - 21:30 EEST
Welcome reception
- Welcome speech
- Key statement
- Walking reception
Conference Day - Tuesday 21th April 2026
09:00 - 22:00 EEST
Opening High-level Fireside Chat “Skilled People Powering Europe’s Innovation and Competitiveness”
- Roxana Minzatu – EVP European Commission (tbc)
- Victor Negrescu, VP European Parliament
- Moderator: ASA Vice-President
Panel Discussion I – Industrial Jobs in the Spotlight: Securing Today’s Workforce, Shaping Tomorrow’s Talent
- Panel discussion with representatives of the whole automotive value chain (covering OEMs, suppliers, value chain stakeholders) to identify key challenges and missing elements of the labor force transformation, challenged by the education providers to close the gap between industry needs and education offer.
- Moderator: Petr Dolejší, Mobility & Sustainable Transport Director, VP ASA
Panel Discussion II – Joint Action for Competitiveness: Aligning National and European Efforts
- Targeted panel with the policy-makers and social partners on EU, national and regional level to respond to the challenges identified by the first panel discussion how to facilitate labor force transition through targeted (and potentially missing) policy measures.
- Moderator: Petr Dolejší, Mobility & Sustainable Transport Director, VP ASA
Advancing Transformation through TRIREME: Insights, Trends, and Development – Presentations, Discussions & Practical Showcase
- Focused discussion on the sectoral skills strategy for the Automotive Ecosystem and ways to promote European approach to training and education development and recognition in the sector.
- Moderator: Jakub Stolfa, ASA President
Hands on regional level and Romania – Good practice examples
- Exchange of views of best practice and concrete results of different regional initiatives in Romania supporting the transformation of the automotive industry with a focus on green and digital competences, enhancing competitiveness, capacity building and innovation uptake.
- Moderator: Bianca , IT Transylvania Cluster President
VENUE
ORGANISERS
The conference is organized in the frame of the TRIREME Project, a four-year ERASMUS+ Blueprint initiative. This conference will publicly kick off the project and will focus on enhancing and updating skills intelligence (trends, skills, and job role needs) and developing new and updated training courses across the Automotive-Mobility Ecosystem, with specific emphasis on Digitalization, Sustainability, Circular Economy, Value Chain Resilience, and New Business Models. A particular focus will be given to addressing the social implications of the twin transition on the workforce.
This year, the conference is co-organised with the European Chips Skills Academy (ECSA), a major initiative supporting the EU Chips Act by strengthening Europe’s talent pipeline in microelectronics and semiconductor manufacturing. ECSA brings together key education, research, and industry partners to develop advanced training offers and foster stronger cross-sector collaboration, particularly relevant for the Automotive-Mobility Ecosystem as vehicles become increasingly dependent on semiconductor technologies. The presence of both TRIREME and ECSA highlights the growing convergence between the automotive and semiconductor sectors and underscores the need for coordinated European skills strategies to ensure technological leadership and resilient value chains.
COLLABORATION
The conference is organized to support collaboration in the Pact for Skills action. Automotive Skills Alliance (ASA) and European Chips Skills Academy (ECSA) are the large-scale partnership for collaboration on skills in Transport-Automotive-Mobility Ecosystem and Semiconductors. They are pioneering partnerships under the Pact for Skills action, and provides support to the implementation of the green and digital transformation of the labour force in the Automotive-mobility and Semiconductor ecosystems and beyond.
Conference participants are also invited to join TIE 2026, which begins on 22 April at the same venue. TIE (Talent Incubator Electronics) is an international, industry-driven educational event where students tackle real-world challenges in electronic packaging and electronic product design. Developed jointly by leading companies and academic experts, TIE connects academia and industry in a high-performance ecosystem, giving students hands-on experience with advanced design, simulation, and validation tools while addressing current technological challenges. See more and register here.
