* Late registration is possible by contacting office@skills-alliance.eu
AGENDA
Monday 20th April 2026
Reception
(14:00) 18:30 - 21:30 EEST
Optional accompanying visit
- TestEcoCel laboratory, Technical University of Cluj-Napoca
- Hydrogen-to-wheel Hardware-in-the-Loop test environment demonstration
- Integrated validation chain (fuel cell, drivetrain, dynamometer)
- Emulated real-world testing for 50–100 kW e-drives
- Visit to ART TU, Formula Student team
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Welcome speech
- Mayor of the city (tbc), City of Cluj-Napoca
- Bianca Muntean, Manager, Transilvania IT Cluster
- Jakub Stolfa, President, Automotive Skills Alliance
- Laith Altimime, SEMI Europe
-
Key statement
- Victor Negrescu, Vice-President, European Parliament
- Walking reception
Tuesday 21th April 2026
Conference Day
09:00 - 22:00 EEST
- Please note that there is no conference fee.
- Daniela Popescu, Vice-rector Technical University of Cluj-Napoca
- Major (tbc), The City of Cluj-Napoca
- Bianca Muntean, Manager, Transilvania IT Cluster
- Jakub Stolfa, Skills (R)Evolution Conference Series Chair & ASA President
- Strategic Aiming of the Skills Agenda in the Automotive-Mobility Ecosystem
- Jakub Stolfa, President, Automotive Skills Alliance (ASA)
- Strategic Aiming of the Skills Agenda in the Semiconductors Ecosystem
- Victoria Cummings, SEMI Europe
- Victor Negrescu, Vice-President, European Parliament
- Adrian Sandu, Secretary General, ACAROM
- Dan Ghirisan, Director, Ford Otosan Craiova
- Ovidiu Maghear, Head of Perception and E2E AI | ADAS Systems, Bosch Engineering Center Cluj
- Gabriela Pontos, HR Manager, Nokian Romania
- Andrei Badea, Communication & Public Policy Manager, Infineon Romania
- Aurora Rossi, IndustriALL
- Rolf Schreuder, Director European Affairs, STEM Coalition
- Cristian Nevzoreanu, Public Affairs, Communication and CSR Director, Renault Group Dacia Romania
- Silvan Morariu, Head of Embedded and Automotive, AROBS Transilvania Software / Commercial Director
- Isabel Sorino Mate, Ceemet
- Viorel Băltărețu, Secretary of State, Ministry of Economy, Digitalization, Entrepreneurship and Tourism
- Matei Arghirescu, Programme Officer, Chips Joint Undertaking
- Ovidiu Pop, Dean, Faculty of Electronics, Telecommunications and Information Technology, Technical University of Cluj-Napoca
- Alexandru Roja, Digital Transformation & Innovation Expert, The European DIH in Transilvania
At the venue & group photo
- Skills transformation of the sector — Findings from research and interviews with industry
- Elisa Pagliaroli, SPIN360
- Competence matrix for the automotive sector & needed job roles
- Joao Alves, ATEC – Training Academy
- Blueprint for training and education & recognition in the automotive sector
- Manuel di Frangia, ADECCO & Marek Spanyik, ASA
- Sectoral Skills Strategy for the Automotive Ecosystem
- Jiri Kubec, ACEA
- Victoria Cummings – Sectoral Skills Strategy
- Oliver Krammer – ECS Academy training development
- Octavian Axinte – Student Ambassador network
- Spotlight speakers and the student network
- Anna Spechtenhauser, WRS, Stuttgart Region
- Oliver Kramer, Budapest University of Technology and Economics
- Victoria Cummings, SEMI Europe, ECSA Project Coordinator
- Jakub Stolfa, ASA President & TRIREME Project Coordinator
- RO-SMARTSYS (Romanian Chip Competence Centre)
- Carmen Moldovan, Director National Institute for Research and Development in Microtechnologies – IMT Bucharest
- Transylvania Energy Cluster (TREC)
- Oana Raita, Executive Director & Cluster Manager
- Technologies of Interconnections in Electronics (TIE)
- Paul Svasta, Professor, Polytechnical University of Bucharest
- BMW Group, TechWorks Romania
- Emil Petru, CEO, Managing Director
- NewCar4Future
- Florin Dehelean, CEO & Founder of Transilvania Mobility Hub
- Solis-EV UTCN
- Petre Dorel Teodosescu, Head of the Electrical Machines and Drives Department
- Vlad Marian, 2nd-year ETTI student, Software Team Coordinator
- Applied Research Center for Electric Mobility (EMARC), UTCN
- Bogdan Varga, Director
- Jakub Stolfa, Skills (R)Evolution Conference Series Chair & ASA President
- Dinner and walking reception with EV Solis and ART TU Cluj-Napoca Formula Car by UTCN & NewCar4Future by Arobs Prototypes Showcase
- Address: Maimuța Plângătoare, st. Sindicatelor 1, 400000 Cluj-Napoca – HERE
VENUE
ORGANISERS
The conference is organized in the frame of the TRIREME Project, a four-year ERASMUS+ Blueprint initiative. This conference will publicly kick off the project and will focus on enhancing and updating skills intelligence (trends, skills, and job role needs) and developing new and updated training courses across the Automotive-Mobility Ecosystem, with specific emphasis on Digitalization, Sustainability, Circular Economy, Value Chain Resilience, and New Business Models. A particular focus will be given to addressing the social implications of the twin transition on the workforce.
This year, the conference is co-organised with the European Chips Skills Academy (ECSA), a major initiative supporting the EU Chips Act by strengthening Europe’s talent pipeline in microelectronics and semiconductor manufacturing. ECSA brings together key education, research, and industry partners to develop advanced training offers and foster stronger cross-sector collaboration, particularly relevant for the Automotive-Mobility Ecosystem as vehicles become increasingly dependent on semiconductor technologies. The presence of both TRIREME and ECSA highlights the growing convergence between the automotive and semiconductor sectors and underscores the need for coordinated European skills strategies to ensure technological leadership and resilient value chains.
COLLABORATION
The conference is organized to support collaboration in the Pact for Skills action. Automotive Skills Alliance (ASA) and European Chips Skills Academy (ECSA) are the large-scale partnership for collaboration on skills in Transport-Automotive-Mobility Ecosystem and Semiconductors. They are pioneering partnerships under the Pact for Skills action, and provides support to the implementation of the green and digital transformation of the labour force in the Automotive-mobility and Semiconductor ecosystems and beyond.
Conference participants are also invited to join TIE 2026, which begins on 22 April at the same venue. TIE (Talent Incubator Electronics) is an international, industry-driven educational event where students tackle real-world challenges in electronic packaging and electronic product design. Developed jointly by leading companies and academic experts, TIE connects academia and industry in a high-performance ecosystem, giving students hands-on experience with advanced design, simulation, and validation tools while addressing current technological challenges. See more and register here.
